METHOD FOR ULTRASONIC BONDING HAVING AT LEAST ONE FIRST AND SECOND ULTRASONIC TRANSDUCER GENERATING HARMONIC OSCILLATING PARTS

• Main Authors: HESSE HANS-JUERGEN, BROEKELMANN MICHAEL
• Format: Patent
• Language: English
• Published: 05.06.2014
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FOR PERFORMING MECHANICAL WORK IN GENERAL; GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

In a method for ultrasonic bonding, two longitudinal ultrasonic waves propagating in a common working plane oriented parallel to a substrate are induced in one or more ultrasonic transducers and are passed through ultrasound-conducting arms from different spatial directions onto a common connection point of the arms. At the connection point the ultrasonic waves cause an ultrasonic tool arranged directly or indirectly at said connection point to oscillate in two or three dimensions. At least one of the ultrasonic transducers induces an ultrasonic wave with a first harmonic oscillation component and a second oscillation component.