METHOD FOR PROCESSING A DIE

In various embodiments, a method for processing a die is provided. The method may include forming a periodic structure at least one of over and in a carrier, the periodic structure including a plurality of structure elements; depositing masking material over the periodic structure; partially removin...

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Bibliographic Details
Main Authors TEGEN STEFAN, LEMKE MARKO
Format Patent
LanguageEnglish
Published 15.05.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:In various embodiments, a method for processing a die is provided. The method may include forming a periodic structure at least one of over and in a carrier, the periodic structure including a plurality of structure elements; depositing masking material over the periodic structure; partially removing masking material to expose at least one structure element but not all of the structure elements; and removing the exposed at least one structure element.
Bibliography:Application Number: US201213674136