METHOD OF DETECTING THE CIRCULAR UNIFORMITY OF THE SEMICONDUCTOR CIRCULAR CONTACT HOLES

A method of detecting the circular uniformity of semiconductor circular contact holes. Several detection circuit structures are disposed on the semiconductor wafer: N-type active regions and P-type active regions; silicon dioxide layers separate the N-type active regions from the P-type active regio...

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Bibliographic Details
Main Authors KUO MINGSHEN, CHEN HUNGLIN, NI QILIANG, WANG KAI, LONG YIN
Format Patent
LanguageEnglish
Published 08.05.2014
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Summary:A method of detecting the circular uniformity of semiconductor circular contact holes. Several detection circuit structures are disposed on the semiconductor wafer: N-type active regions and P-type active regions; silicon dioxide layers separate the N-type active regions from the P-type active regions; the N-type active regions are formed in the P well and the P-type active regions are formed in the N well; polysilicon gates bridge the N-type active regions and the P-type active regions; gate oxide layers insulate the P-type regions and the N-type regions from the polysilicon gates, so that the P-type regions and the N-type regions are independent; the N-type active regions connect with circular contact holes while the P-type active regions and the polysilicon gates connect with oval contact holes; a electron beam scanner detects the circular uniformity of the contact holes. This invention advantageously reflects effectively and comprehensively the circular uniformity of the contact holes.
Bibliography:Application Number: US201314053750