Electronic Component comprising a Ceramic Carrier and use of a Ceramic Carrier

An electronic component for high-temperature applications includes a ceramic carrier and a semiconductor element. The ceramic carrier comprises a ceramic substrate having a content of alkali metal compounds of @0.5%, more particularly @0.05%, and the ceramic substrate is selected from the group cons...

Full description

Saved in:
Bibliographic Details
Main Authors MARTIN ALEXANDER, GLANZ UWE, HENNECK STEFAN
Format Patent
LanguageEnglish
Published 13.03.2014
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:An electronic component for high-temperature applications includes a ceramic carrier and a semiconductor element. The ceramic carrier comprises a ceramic substrate having a content of alkali metal compounds of @0.5%, more particularly @0.05%, and the ceramic substrate is selected from the group consisting of: a ceramic substrate comprising aluminium oxide, anorthite, a filler having a coefficient of thermal expansion of @4.0*10-6K-1 and glass; a ceramic substrate comprising aluminium oxide, celsian, a filler having a coefficient of thermal expansion of @4.0*10-6K-1 and glass; and a ceramic substrate comprising an alkaline earth metal silicate glass having a silicon dioxide content of >50 mol %, boron oxide, and a filler having a coefficient of thermal expansion of <4.0*10-6K-1. The component prevents temperature damage at high temperatures and has constant properties, such as electrical insulation properties, up to 500° C.
Bibliography:Application Number: US201213981816