ENCLOSURE ASSEMBLY AND SYSTEMS AND METHODS FOR USING THE SAME
An enclosure assembly and systems and methods for using the same are disclosed. The enclosure assembly may include a base plate, a plurality of sidewalls, and one or more insulator layers disposed on the sidewalls. When coupled to a module, the enclosure assembly may least partially enclose the modu...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
06.03.2014
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Subjects | |
Online Access | Get full text |
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Summary: | An enclosure assembly and systems and methods for using the same are disclosed. The enclosure assembly may include a base plate, a plurality of sidewalls, and one or more insulator layers disposed on the sidewalls. When coupled to a module, the enclosure assembly may least partially enclose the module to prevent the spread of EMI, to assist in heat dissipation, to protect the structural integrity of the module, and the like. |
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Bibliography: | Application Number: US201213605625 |