ENCAPSULENT FOR A PHOTOVOLTAIC MODULE

An encapsulant for a photovoltaic module, intended to coat a photovoltaic cell, including at least two adjacent thermoplastic layers together forming a core-skin assembly: the skin layer is a polyamide graft polymer including a polyolefin backbone representing 50 wt % to 95 wt % of the polyamide gra...

Full description

Saved in:
Bibliographic Details
Main Authors BIZET STEPHANE, FINE THOMAS, JOUSSET DOMINIQUE, DEVISME SAMUEL
Format Patent
LanguageEnglish
Published 30.01.2014
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:An encapsulant for a photovoltaic module, intended to coat a photovoltaic cell, including at least two adjacent thermoplastic layers together forming a core-skin assembly: the skin layer is a polyamide graft polymer including a polyolefin backbone representing 50 wt % to 95 wt % of the polyamide graft polymer, containing a residue of at least one unsaturated monomer (X) and at least one polyamide graft, representing 5 wt % to 50 wt % of said polyamide graft polymer; the polyolefin backbone and the polyamide graft of the skin layer are chosen so that the polyamide graft polymer has a flow temperature greater than or equal to 75° C. and less than or equal to 160° C., this flow temperature being defined as the highest temperature out of the melting temperature and the glass transition temperature of the polyamide graft and of the polyolefin backbone.
Bibliography:Application Number: US201213984468