ELECTRICAL MARGINING OF MULTI-PARAMETER HIGH-SPEED INTERCONNECT LINKS WITH MULTI-SAMPLE PROBING

• Main Authors: RANGARAJAN THANUNATHAN, KUMAR ARVIND A, CHHABBI SHREESH, IYER VENKATRAMAN
• Format: Patent
• Language: English
• Published: 02.01.2014
• Subjects: MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; TESTING

Methods and apparatus relating to electrical margining of multi-parameter high-speed interconnect links with multi-sample probing are described. In one embodiment, logic is provided to generate one or more parameter values, corresponding to an electrical operating margin of an interconnect. The one or more parameter values are generated based on a plurality of eye observation sets to be detected in response to operation of the interconnect in accordance with a plurality of parameter sets (e.g., by using quantitative optimization techniques). In turn, the interconnect is to be operated at the one or more parameter values if it is determined that the one or more parameter values cause the interconnect to operate at an optimum level relative to an operation of the interconnect in accordance with one or more less optimum parameter levels. Other embodiments are also disclosed and claimed.