EDGE SEAL FOR LOWER ELECTRODE ASSEMBLY

A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled lower base plate, an upper plate, a mounting groove surrounding a bond layer and an edge seal comprising an elastomeric band having an outer concave surface in...

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Bibliographic Details
Main Authors LEE SUNG, CHHATRE AMBARISH, LAI BROOKE MESLER, GAFF KEITH WILLIAM, SCHAEFER DAVID
Format Patent
LanguageEnglish
Published 26.12.2013
Subjects
BLASTING
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
CYLINDERS
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ENGINEERING ELEMENTS AND UNITS
GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS
GENERATION
HEATING
LIGHTING
MECHANICAL ENGINEERING
PISTONS
SEALINGS
THERMAL INSULATION IN GENERAL
WEAPONS
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Summary:A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled lower base plate, an upper plate, a mounting groove surrounding a bond layer and an edge seal comprising an elastomeric band having an outer concave surface in an uncompressed state, the band mounted in the groove such that upper and lower ends of the band are axially compressed and a maximum outward bulging of the band is no greater than a predetermined distance.
Bibliography:Application Number: US201213528194