Electronic Device and Cover Assembly

A cover assembly applied to an electronic device is disclosed. The electronic device includes a first component and a second component, and an opening is formed between the first component and the second component. The cover assembly includes a cover element, at least one first moving element, at le...

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Bibliographic Details
Main Authors HSIAO HSIN-HUNG, LIU YU-SE
Format Patent
LanguageEnglish
Published 05.12.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A cover assembly applied to an electronic device is disclosed. The electronic device includes a first component and a second component, and an opening is formed between the first component and the second component. The cover assembly includes a cover element, at least one first moving element, at least one second moving element and an elastic element. The cover element is disposed in the opening, attached to the second component, and abutted against the first component. The first moving element is connected to the cover element and includes at least one first moving part. The second moving element is connected to the second component and includes at least one second moving part. The elastic element is connected between the first moving element and the second moving element, and provides an elastic force to make the cover element continuously abutted against the first component and cover the opening.
Bibliography:Application Number: US201313902434