HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD FOR MEASURING PARTICLE CONCENTRATION

A heat treatment apparatus includes a chamber for receiving a substrate therein, and a measurement part for measuring an air particle concentration in a processing space provided in the chamber. An air particle concentration in the processing space provided in the chamber is measured by the measurem...

Full description

Saved in:
Bibliographic Details
Main Author NISHIHARA HIDEO
Format Patent
LanguageEnglish
Published 28.11.2013
Subjects
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PERFORMING OPERATIONS
PHYSICS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TESTING
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:A heat treatment apparatus includes a chamber for receiving a substrate therein, and a measurement part for measuring an air particle concentration in a processing space provided in the chamber. An air particle concentration in the processing space provided in the chamber is measured by the measurement part. The air particle concentration is correlated with the number of particles attached to a substrate received in the chamber. Accordingly, by conducting a particle test after the air particle concentration in the processing space is lowered to an air particle concentration corresponding to the number of particles existing on the substrate which can pass the particle test, the number of times the particle test should be conducted after maintenance of the heat treatment apparatus can be reduced.
Bibliography:Application Number: US201313895540