GLASS SUBSTRATE LASER CUTTING DEVICE WITH REAL-TIME BREAKING DETECTING FUNCTION AND GLASS SUBSTRATE BREAKAGE DETECTING METHOD THEREOF

A glass substrate laser cutting device according to the invention includes: a working table that has a plurality of vacuum absorbing grooves; a laser cutter; a pressure sensor that measures a pressure sensor when suctioning the glass substrate in a vacuum state; a calculation processing unit that co...

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Bibliographic Details
Main Authors PARK WON-KYU, KOO JA-YONG, KIM SUNG CHEAL, ROH HYUNG-SANG, LEE CHANG-HA
Format Patent
LanguageEnglish
Published 07.11.2013
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Summary:A glass substrate laser cutting device according to the invention includes: a working table that has a plurality of vacuum absorbing grooves; a laser cutter; a pressure sensor that measures a pressure sensor when suctioning the glass substrate in a vacuum state; a calculation processing unit that compares the vacuum pressure measured by the pressure sensor with a predetermined threshold pressure and determines whether the glass substrate is broken; a laser cutter that includes a leaser head moving along the cutting direction of the glass substrate and emitting a laser beam; and an optical sensor that is attached to the laser head so as to move together and is disposed at a point in front of the laser beam emitted to the outside so as to detect the breakage of the glass substrate.
Bibliography:Application Number: US201213543497