SUPERSPEED INTER-CHIP COMMUNICATIONS

An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB 3.0 system interface and an M-PHY int...

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Bibliographic Details
Main Authors CHELLAPPAN SATHEESH, VADIVELU KARTHI R, SARWAR ZEESHAN, SHARMA SHALINI, RANGANATHAN SRIDHARAN, HARRIMAN DAVID J, MUKKER ANOOP
Format Patent
LanguageEnglish
Published 03.10.2013
Subjects
CALCULATING
CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION ANDCOMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION ANDCOMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THIR OWNENERGY USE
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
PHYSICS
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Summary:An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB 3.0 system interface and an M-PHY interface.
Bibliography:Application Number: US201213435926