PACKAGE INCLUDING AN UNDERFILL MATERIAL IN A PORTION OF AN AREA BETWEEN THE PACKAGE AND A SUBSTRATE OR ANOTHER PACKAGE
Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having a substrate or a first package, and a second package coupled to the substrate or the first package, wherein the second package includes at least one die and an underfill...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
03.10.2013
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Subjects | |
Online Access | Get full text |
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Summary: | Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having a substrate or a first package, and a second package coupled to the substrate or the first package, wherein the second package includes at least one die and an underfill material disposed in a portion, but not an entirety, of an area between the package and the substrate or the first package. Other embodiments may be described and claimed. |
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Bibliography: | Application Number: US201313902244 |