High Throughput TEM Preparation Processes and Hardware for Backside Thinning of Cross-Sectional View Lamella

A method for TEM sample preparation and analysis that can be used in a FIB-SEM system without re-welds, unloads, user handling of the lamella, or a motorized flip stage. The method allows a dual beam FIB-SEM system with a typical tilt stage to be used to extract a sample to from a substrate, mount t...

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Bibliographic Details
Main Authors BLACKWOOD JEFF, STONE STACEY, KEADY PAUL, HENRY CRAIG, DAS GUUS, SCHMIDT MICHAEL, PETERSON BRENNAN, DWORKIN LARRY
Format Patent
LanguageEnglish
Published 26.09.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
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Summary:A method for TEM sample preparation and analysis that can be used in a FIB-SEM system without re-welds, unloads, user handling of the lamella, or a motorized flip stage. The method allows a dual beam FIB-SEM system with a typical tilt stage to be used to extract a sample to from a substrate, mount the sample onto a TEM sample holder capable of tilting, thin the sample using FIB milling, and rotate the sample so that the sample face is perpendicular to an electron column for STEM imaging.
Bibliography:Application Number: US201213691270