HOUSING FOR ELECTRONIC EQUIPMENT AND MANUFACTURING METHOD THEREOF

A method for manufacturing a housing for an electronic equipment containing metal housing configured to house an electronic equipment therein and a resin film with which the metal housing is coated includes the steps of heating a resin film so as to soften the resin film, coating a metal housing wit...

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Bibliographic Details
Main Authors ISHIDUKA MASANOBU, KIMURA KOICHI
Format Patent
LanguageEnglish
Published 26.09.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Summary:A method for manufacturing a housing for an electronic equipment containing metal housing configured to house an electronic equipment therein and a resin film with which the metal housing is coated includes the steps of heating a resin film so as to soften the resin film, coating a metal housing with the heated resin film, and adhering the coated resin film to the metal housing. The preferred housing is one in which an adhesive layer, a print layer, or both thereof is disposed between a resin layer contained in the resin film and the metal housing, and in which the resin film contains at least one thermoplastic resin selected from the group consisting of polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), and polylactic acid (PLA).
Bibliography:Application Number: US201313893646