3D-SHAPED COMPONENT WITH A CIRCUIT TRACE PATTERN AND METHOD FOR MAKING THE SAME

A 3D-shaped component includes a 3D-shaped plastic film having a surface, and a circuit trace pattern that is disposed at the surface of the 3D-shaped plastic film, that is embedded in the 3D-shaped plastic film, and that is made from a cured conductive ink.

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Bibliographic Details
Main Authors CHEN YENOU, HSIAO CHENG-YEH, YANG WEN-PAO
Format Patent
LanguageEnglish
Published 19.09.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A 3D-shaped component includes a 3D-shaped plastic film having a surface, and a circuit trace pattern that is disposed at the surface of the 3D-shaped plastic film, that is embedded in the 3D-shaped plastic film, and that is made from a cured conductive ink.
Bibliography:Application Number: US201213710846