Semiconductor Device and Method of Forming Semiconductor Die with Active Region Responsive to External Stimulus

A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die. A conductive layer can be formed over the encapsulant and the semiconductor die. A transmissive layer can be formed over the semiconductor die. An interconnect structure can be formed through the...

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Bibliographic Details
Main Authors SHIM IL KWON, STROTHMANN THOMAS J, ANDERSON STEVE, KUAN HEAP HOE, HAN BYUNG JOON
Format Patent
LanguageEnglish
Published 29.08.2013
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