Semiconductor Device and Method of Forming Semiconductor Die with Active Region Responsive to External Stimulus

A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die. A conductive layer can be formed over the encapsulant and the semiconductor die. A transmissive layer can be formed over the semiconductor die. An interconnect structure can be formed through the...

Full description

Saved in:
Bibliographic Details
Main Authors SHIM IL KWON, STROTHMANN THOMAS J, ANDERSON STEVE, KUAN HEAP HOE, HAN BYUNG JOON
Format Patent
LanguageEnglish
Published 29.08.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die. A conductive layer can be formed over the encapsulant and the semiconductor die. A transmissive layer can be formed over the semiconductor die. An interconnect structure can be formed through the encapsulant and electrically connected to the conductive layer, whereby the interconnect structure is formed off to only one side of the semiconductor die.
Bibliography:Application Number: US201313853969