Semiconductor Device and Method of Forming Semiconductor Die with Active Region Responsive to External Stimulus
A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die. A conductive layer can be formed over the encapsulant and the semiconductor die. A transmissive layer can be formed over the semiconductor die. An interconnect structure can be formed through the...
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| Main Authors | , , , , |
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| Format | Patent |
| Language | English |
| Published |
29.08.2013
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die. A conductive layer can be formed over the encapsulant and the semiconductor die. A transmissive layer can be formed over the semiconductor die. An interconnect structure can be formed through the encapsulant and electrically connected to the conductive layer, whereby the interconnect structure is formed off to only one side of the semiconductor die. |
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| AbstractList | A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die. A conductive layer can be formed over the encapsulant and the semiconductor die. A transmissive layer can be formed over the semiconductor die. An interconnect structure can be formed through the encapsulant and electrically connected to the conductive layer, whereby the interconnect structure is formed off to only one side of the semiconductor die. |
| Author | KUAN HEAP HOE HAN BYUNG JOON SHIM IL KWON ANDERSON STEVE STROTHMANN THOMAS J |
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| Notes | Application Number: US201313853969 |
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| Snippet | A semiconductor device has a semiconductor die and an encapsulant deposited over the semiconductor die. A conductive layer can be formed over the encapsulant... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Semiconductor Device and Method of Forming Semiconductor Die with Active Region Responsive to External Stimulus |
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