POLISHING COMPOSITION AND POLISHING METHOD

A polishing composition contains a water-soluble polymer, a polishing accelerator, and an oxidizing agent. The water-soluble polymer is a polyamide-polyamine polymer having an amine value of 150 mg KOH/1 g·solid or greater.

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Bibliographic Details
Main Authors TAMADA SHUICHI, SUMITA KAZUYA, IZAWA YOSHIHIRO, UMEDA TAKAHIRO, HIRANO TATSUHIKO
Format Patent
LanguageEnglish
Published 08.08.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A polishing composition contains a water-soluble polymer, a polishing accelerator, and an oxidizing agent. The water-soluble polymer is a polyamide-polyamine polymer having an amine value of 150 mg KOH/1 g·solid or greater.
Bibliography:Application Number: US201113814644