Semiconductor Package Having an Interposer Configured for Magnetic Signaling
There are disclosed herein various implementations of semiconductor packages having an interposer configured for magnetic signaling. One exemplary implementation includes a die transmit pad in an active die for transmitting a magnetic signal corresponding to a die electrical signal produced by the a...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
01.08.2013
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Subjects | |
Online Access | Get full text |
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Summary: | There are disclosed herein various implementations of semiconductor packages having an interposer configured for magnetic signaling. One exemplary implementation includes a die transmit pad in an active die for transmitting a magnetic signal corresponding to a die electrical signal produced by the active die, and an interposer magnetic tunnel junction (MTJ) pad in the interposer for receiving the magnetic signal. A sensing circuit is coupled to the interposer MTJ pad for producing a receive electrical signal corresponding to the magnetic signal. In one implementation, the sensing circuit is configured to sense a resistance of the interposer MTJ pad and to produce the receive electrical signal according to the sensed resistance. |
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Bibliography: | Application Number: US201213361598 |