WAFER FILL PATTERNS AND USES

A semiconductor device includes an active region including an element formed in a double etch, double exposure method and an inactive region including one or more fills, at least one of the one or more fills including a cut-away hole formed therein, where the cut-away holes expose a layer in the ina...

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Bibliographic Details
Main Authors WANG HELEN, HALLE SCOTT D, GABOR ALLEN H, BURKHARDT MARTIN, GLUSHCENKOV OLEG, LANDIS HOWARD S, COLBURN MATTHEW E
Format Patent
LanguageEnglish
Published 18.07.2013
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Summary:A semiconductor device includes an active region including an element formed in a double etch, double exposure method and an inactive region including one or more fills, at least one of the one or more fills including a cut-away hole formed therein, where the cut-away holes expose a layer in the inactive region used for an endpoint detection.
Bibliography:Application Number: US201313788776