SUBSTRATE TEMPERATURE ADJUSTING-FIXING DEVICE AND MANUFACTURING METHOD THEREOF

• Main Authors: SHIMIZU KAZUNORI, KOMATSU HIDEHIRO, NAGAI KOJI, KURIBAYASHI AKIHIRO
• Format: Patent
• Language: English
• Published: 13.06.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERATION; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

A substrate temperature adjusting-fixing device includes an electro static chuck attracting and holding an object to be attracted; a base plate to which the electro static chuck is fixed; an adhesive layer formed between the electro static chuck and the base plate; and a heat insulation layer formed between the electro static chuck and the base plate, wherein the electro static chuck includes a base body having a mounting surface on which the object to be attracted is mounted, a heat generator directly formed on a surface opposite to the mounting surface of the base body, and an insulating layer formed to cover the heat generator.