Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw

Methods are disclosed for controlling surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by changing...

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Bibliographic Details
Main Authors SEVERICO FERDINANDO, ZAVATTARI CARLO, VERCELLONI GABRIELE, VANDAMME ROLAND R, BHAGAVAT SUMEET S
Format Patent
LanguageEnglish
Published 06.06.2013
Subjects
BROACHING
FILING
LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PLANING
SAWING
SCRAPING
SHEARING
SLOTTING
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Summary:Methods are disclosed for controlling surface profiles of wafers cut in a wire saw machine. The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot by controlling the shape of the wafers. The shape of the wafers is altered by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings supporting wire guides of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology.
Bibliography:Application Number: US201113309260