SUPPRESSING TIN WHISKER GROWTH IN LEAD-FREE SOLDERS AND PLATNGS

A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncat...

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Bibliographic Details
Main Authors LAM POH-SANG, HOFFMAN ELIZABETH N
Format Patent
LanguageEnglish
Published 11.04.2013
Subjects
GAMMA RAY OR X-RAY MICROSCOPES
IRRADIATION DEVICES
NUCLEAR ENGINEERING
NUCLEAR PHYSICS
PHYSICS
TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOTOTHERWISE PROVIDED FOR
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Summary:A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.
Bibliography:Application Number: US201113269803