PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD
[Problems] The present invention provides a photosensitive resin composition having good dryness to touch and excellent resistance to electroless gold plating; a cured film thereof; and a printed circuit board comprising the cured film. [Means for Solution] The photosensitive resin composition is ch...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
04.04.2013
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| Subjects | |
| Online Access | Get full text |
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| Abstract | [Problems] The present invention provides a photosensitive resin composition having good dryness to touch and excellent resistance to electroless gold plating; a cured film thereof; and a printed circuit board comprising the cured film. [Means for Solution] The photosensitive resin composition is characterized by comprising (A) an acid-modified photosensitive epoxy resin, (B) a non-photosensitive carboxylic acid resin and (C) a liquid bifunctional epoxy resin. It is preferred that the above-described (B) non-photosensitive carboxylic acid resin have a weight-average molecular weight of 10,000 to 30,000. |
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| AbstractList | [Problems] The present invention provides a photosensitive resin composition having good dryness to touch and excellent resistance to electroless gold plating; a cured film thereof; and a printed circuit board comprising the cured film. [Means for Solution] The photosensitive resin composition is characterized by comprising (A) an acid-modified photosensitive epoxy resin, (B) a non-photosensitive carboxylic acid resin and (C) a liquid bifunctional epoxy resin. It is preferred that the above-described (B) non-photosensitive carboxylic acid resin have a weight-average molecular weight of 10,000 to 30,000. |
| Author | NORIKOSHI AKIO ARIMA MASAO |
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| Notes | Application Number: US201213630682 |
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| RelatedCompanies | TAIYO INK MFG. CO., LTD TAIYO INK MFG. CO. LTD |
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| Snippet | [Problems] The present invention provides a photosensitive resin composition having good dryness to touch and excellent resistance to electroless gold plating;... |
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| SubjectTerms | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| Title | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD |
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