PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD

[Problems] The present invention provides a photosensitive resin composition having good dryness to touch and excellent resistance to electroless gold plating; a cured film thereof; and a printed circuit board comprising the cured film. [Means for Solution] The photosensitive resin composition is ch...

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Bibliographic Details
Main Authors NORIKOSHI AKIO, ARIMA MASAO
Format Patent
LanguageEnglish
Published 04.04.2013
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:[Problems] The present invention provides a photosensitive resin composition having good dryness to touch and excellent resistance to electroless gold plating; a cured film thereof; and a printed circuit board comprising the cured film. [Means for Solution] The photosensitive resin composition is characterized by comprising (A) an acid-modified photosensitive epoxy resin, (B) a non-photosensitive carboxylic acid resin and (C) a liquid bifunctional epoxy resin. It is preferred that the above-described (B) non-photosensitive carboxylic acid resin have a weight-average molecular weight of 10,000 to 30,000.
Bibliography:Application Number: US201213630682