INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an interposer having a top interposer surface over the substrate; attaching an interposer pad extension to the top interposer surface, the interposer pad extension having an extension contact...

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Bibliographic Details
Main Authors CHOI A LEAM, YANG DEOKKYUNG, BAE JOHYUN
Format Patent
LanguageEnglish
Published 21.03.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an interposer having a top interposer surface over the substrate; attaching an interposer pad extension to the top interposer surface, the interposer pad extension having an extension contact surface and a lower contact surface, the surface area of the extension contact surface being smaller than the surface area of the lower contact surface; and forming a package encapsulation on the substrate, the interposer, and the interposer pad extension, the package encapsulation having a recess exposing the top interposer surface, the interposer pad extension embedded only in the package encapsulation.
Bibliography:Application Number: US201113237918