INTEGRATED CIRCUIT SYSTEM WITH TEST PADS AND METHOD OF MANUFACTURE THEREOF

A method of manufacture of an integrated circuit system includes: providing a substrate having a test pad with element pads; forming a conductive layer over the test pad, the conductive layer having element layers directly on the element pads; and mounting an integrated circuit over the substrate.

Saved in:
Bibliographic Details
Main Authors HUANG RUI, XUSHENG BAO
Format Patent
LanguageEnglish
Published 21.03.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A method of manufacture of an integrated circuit system includes: providing a substrate having a test pad with element pads; forming a conductive layer over the test pad, the conductive layer having element layers directly on the element pads; and mounting an integrated circuit over the substrate.
Bibliography:Application Number: US201113239373