FILM-FORMING RADIATION-CROSSLINKING ADHESIVE
Radiation-crosslinkable hot-melt adhesives containing more than 50% of polyurethane polymers which contain at least one radiation-polymerizable reactive group. The radiation-crosslinkable hot-melt adhesive is prepared by reacting a) a reactive PU prepolymer having a particular block structure b) 20...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
21.03.2013
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Subjects | |
Online Access | Get full text |
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Summary: | Radiation-crosslinkable hot-melt adhesives containing more than 50% of polyurethane polymers which contain at least one radiation-polymerizable reactive group. The radiation-crosslinkable hot-melt adhesive is prepared by reacting a) a reactive PU prepolymer having a particular block structure b) 20 to 95 mol % of at least one low-molecular-weight compound (B) containing a radically polymerizable double bond and a group reacting with an NCO group; c) 0 to 50 mol % of at least one compound (C) having at least one group reactive to NCO groups but no group that is polymerizable under radical conditions, with a molar mass of 32 to 5000 g/mol; d) 5 to 50 mol % of at least one radical photoinitiator (D) having a primary or secondary OH group, as well as optionally further polymers and/or auxiliary substances. The adhesives can be cured for bonding nonwoven substrates or for coating labels, tapes, films and plasters with pressure-sensitive adhesive coatings. |
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Bibliography: | Application Number: US201213673631 |