LEAD FRAME DESIGN TO IMPROVE RELIABILITY

An electronic device package 100 comprising a lead frame 105 having at least one lead 110 with a notch 205. The notch includes at least one reentrant angle 210 of greater than 180 degrees and the notch is located distal to a cut end 1010 of the lead.

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Bibliographic Details
Main Authors OSENBACH JOHN W, GOLICK LARRY, STAHLEY MATTHEW E, LOW QWAI HOONG
Format Patent
LanguageEnglish
Published 21.03.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic device package 100 comprising a lead frame 105 having at least one lead 110 with a notch 205. The notch includes at least one reentrant angle 210 of greater than 180 degrees and the notch is located distal to a cut end 1010 of the lead.
Bibliography:Application Number: US201213677547