METHOD FOR PRODUCING CHIP STACKS, AND A CARRIER FOR CARRYING OUT THE METHOD

The invention relates to a method for producing chip stacks with the following method sequence: applying an especially dielectric and/or photo structurable base layer to one carrier side of a carrier which on its carrier side is provided with an adhesively acting adhesion zone and a less adhesively...

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Bibliographic Details
Main Author WIMPLINGER MARKUS
Format Patent
LanguageEnglish
Published 14.03.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:The invention relates to a method for producing chip stacks with the following method sequence: applying an especially dielectric and/or photo structurable base layer to one carrier side of a carrier which on its carrier side is provided with an adhesively acting adhesion zone and a less adhesively acting support zone, the base layer being applied largely over the entire surface at least to the support zone, building up the chip stacks on the base layer, potting of the chip stacks, detaching the carrier from the base layer. Moreover the invention relates to a carrier for executing this method.
Bibliography:Application Number: US201013698088