PRINTED CIRCUIT BOARD INCLUDING UNDER-FILL DAM AND FABRICATION METHOD THEREOF

The present invention relates to an under-fill dam with high detection probability that is composed of a dry film solder resist and provided in the form of a fence around a chip device in order to prevent leaks of an under-fill material filled in a gap between a substrate and the chip device.

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Bibliographic Details
Main Authors CHOI BYUNG-JU, JEONG WOO-JAE, LEE KWANG-JOO, JEONG MIN-SU, CHOI BO-YUN
Format Patent
LanguageEnglish
Published 14.03.2013
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:The present invention relates to an under-fill dam with high detection probability that is composed of a dry film solder resist and provided in the form of a fence around a chip device in order to prevent leaks of an under-fill material filled in a gap between a substrate and the chip device.
Bibliography:Application Number: US201113699275