COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD OF PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICE, AND COPPER ALLOY ROLLED MATERIAL FOR ELECTRONIC DEVICE

A copper alloy for an electronic device containing Mg in a range of 2.6 atomic % or more and 9.8 atomic % or less, Al in a range of 0.1 atomic % or more and 20 atomic % or less, and the balance substantially consisting of Cu and unavoidable impurities.

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Bibliographic Details
Main Authors ITO YUKI, MAKI KAZUNARI
Format Patent
LanguageEnglish
Published 07.03.2013
Subjects
ALLOYS
BASIC ELECTRIC ELEMENTS
CABLES
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS
CHEMISTRY
CONDUCTORS
CURRENT COLLECTORS
ELECTRICITY
FERROUS OR NON-FERROUS ALLOYS
INSULATORS
LINE CONNECTORS
METALLURGY
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Summary:A copper alloy for an electronic device containing Mg in a range of 2.6 atomic % or more and 9.8 atomic % or less, Al in a range of 0.1 atomic % or more and 20 atomic % or less, and the balance substantially consisting of Cu and unavoidable impurities.
Bibliography:Application Number: US201113697441