POLYIMIDE FILM AND WIRING BOARD

A polyimide film for production of a wiring board having a metal wiring, which is formed by forming a metal layer on one side (Side B) of the polyimide film, and etching the metal layer; the polyimide film is curled toward the side (Side A) opposite Side B; and the curling of the polyimide film is c...

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Bibliographic Details
Main Authors MAEDA SHUICHI, YOKOZAWA TADAHIRO, YAMAGUCHI HIROAKI
Format Patent
LanguageEnglish
Published 15.11.2012
Subjects
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
PERFORMING OPERATIONS
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
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Summary:A polyimide film for production of a wiring board having a metal wiring, which is formed by forming a metal layer on one side (Side B) of the polyimide film, and etching the metal layer; the polyimide film is curled toward the side (Side A) opposite Side B; and the curling of the polyimide film is controlled so as to reduce the drooping of the wiring board having a metal wiring formed thereon. The handling characteristics and productivity in IC chip mounting may be improved by the use of the polyimide film.
Bibliography:Application Number: US201213557619