METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO WATCH

The present invention reduces the value of a bonding width L of a base substrate and a lid substrate in each piezoelectric vibrator. A plurality of lid substrates 3 each including a recess portion 3a are formed and a bonding film is formed on a wafer for lid substrate 50. The wafer for base substrat...

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Bibliographic Details
Main Author FUNABIKI YOICHI
Format Patent
LanguageEnglish
Published 04.10.2012
Subjects
ELECTRICITY
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Summary:The present invention reduces the value of a bonding width L of a base substrate and a lid substrate in each piezoelectric vibrator. A plurality of lid substrates 3 each including a recess portion 3a are formed and a bonding film is formed on a wafer for lid substrate 50. The wafer for base substrate 40 is opposed and anodic-bonded to the wafer for lid substrate 50 to produce a wafer unit 60 including a plurality of piezoelectric vibrators 1. Then, a microgroove 813 is formed by applying laser along a cutting line for each of the piezoelectric vibrators 1 on the side of the wafer for lid substrate 50, and a sharp pressing blade 830 is pressed on the opposite side, thereby performing sequential cutting.
Bibliography:Application Number: US201213432429