Sensor module and method for manufacturing a sensor module

• Main Authors: HORTIG MICHAEL, SCHRIMPF THOMAS
• Format: Patent
• Language: English
• Published: 04.10.2012
• Subjects: ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS; BASIC ELECTRIC ELEMENTS; CURRENT COLLECTORS; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; LINE CONNECTORS; MEASURING; MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PHYSICS; TARIFF METERING APPARATUS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TESTING; TRANSPORTING

A sensor module has an electrically conductive part, a first sensor element, and a second sensor element, the first sensor element being situated in a first accommodating area of the conductive part, and the second sensor element being situated in a second accommodating area of the conductive part, and the conductive part furthermore having a bent area situated between the first and the second accommodating areas so that the second accommodating area is oriented at an angle with respect to the first accommodating area.