Termination and Contact Structures for a High Voltage Gan-Based Heterojunction Transistor

A semiconductor device is provided that includes a substrate, a first active layer disposed over the substrate, and a second active layer disposed on the first active layer. The second active layer has a higher bandgap than the first active layer such that a two-dimensional electron gas layer arises...

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Bibliographic Details
Main Authors MURPHY MICHAEL, POPHRISTIC MILAN
Format Patent
LanguageEnglish
Published 20.09.2012
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Summary:A semiconductor device is provided that includes a substrate, a first active layer disposed over the substrate, and a second active layer disposed on the first active layer. The second active layer has a higher bandgap than the first active layer such that a two-dimensional electron gas layer arises between the first active layer and the second active layer. A termination layer, which is disposed on the second active layer, includes InGaN. Source, gate and drain contacts are disposed on the termination layer.
Bibliography:Application Number: US201213458703