SEMICONDUCTOR PROCESSING SHEET

• Main Authors: MORI JUNKI, WATANABE KEISUKE, MORIMOTO MASAKAZU, NATSUME MASAYOSHI
• Format: Patent
• Language: English
• Published: 16.08.2012
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DRESSING OR CONDITIONING OF ABRADING SURFACES; DYES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; POLISHING; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

A semiconductor processing sheet contains a base layer having a plastic sheet containing pigment as a core layer, wherein a non-pigment-containing layer is arranged in the outermost layer on front and back main surfaces of the core layer. According to the present invention, in a process for manufacturing semiconductor devices, it is possible to minimize contamination of the inner surface for the film manufacturing die that is due to the pigment contained in the film while maintaining the visibility of the semiconductor processing sheet. Consequently, partial occlusion of the die lip aperture due to pigment contamination is reduced, with the result that effective prevention of the deterioration of the sheet thickness precision due to adhering pigment is possible.