CORELESS LAYER BUILDUP STRUCTURE

A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin.

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Bibliographic Details
Main Authors WILSON WILLIAM E, DAS RABINDRA N, EGITTO FRANK D, ANTESBERGER TIMOTHY, MARKOVICH VOYA R
Format Patent
LanguageEnglish
Published 28.06.2012
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin.
Bibliography:Application Number: US20100764993