Metrology Apparatus, Lithography Apparatus and Method of Measuring a Property of a Substrate

A metrology apparatus is configured to measure a property of a substrate. The metrology apparatus includes an illumination system configured to condition a radiation beam, an objective lens configured to project radiation onto the substrate, a detector configured to detect radiation reflected from a...

Full description

Saved in:
Bibliographic Details
Main Authors VAN ASTEN NICOLAAS ANTONIUS ALLEGONDU, VAN DER MAST KAREL DIEDERICK, DEN BOEF ARIE JEFFREY, VAN DE KERKHOF MARCUS ADRIANUS
Format Patent
LanguageEnglish
Published 19.04.2012
Subjects
ACCESSORIES THEREFOR
APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES
APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHOTOGRAPHY
PHYSICS
TESTING
Online AccessGet full text

Cover

More Information
Summary:A metrology apparatus is configured to measure a property of a substrate. The metrology apparatus includes an illumination system configured to condition a radiation beam, an objective lens configured to project radiation onto the substrate, a detector configured to detect radiation reflected from a surface of the substrate, and an image field selecting device in the path of the reflected radiation constructed and arranged to select an area of an image field associated with the substrate. The selected area corresponds with a predetermined portion of the substrate. This arrangement may enable selection of different shapes and sizes of targets on the substrate and may enable in-die measurement of selected parameters.
Bibliography:Application Number: US200913263216