Metrology Apparatus, Lithography Apparatus and Method of Measuring a Property of a Substrate
A metrology apparatus is configured to measure a property of a substrate. The metrology apparatus includes an illumination system configured to condition a radiation beam, an objective lens configured to project radiation onto the substrate, a detector configured to detect radiation reflected from a...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
19.04.2012
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Subjects | |
Online Access | Get full text |
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Summary: | A metrology apparatus is configured to measure a property of a substrate. The metrology apparatus includes an illumination system configured to condition a radiation beam, an objective lens configured to project radiation onto the substrate, a detector configured to detect radiation reflected from a surface of the substrate, and an image field selecting device in the path of the reflected radiation constructed and arranged to select an area of an image field associated with the substrate. The selected area corresponds with a predetermined portion of the substrate. This arrangement may enable selection of different shapes and sizes of targets on the substrate and may enable in-die measurement of selected parameters. |
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Bibliography: | Application Number: US200913263216 |