LOW TEMPERATURE ETCHANT FOR TREATMENT OF SILICON-CONTAINING SURFACES
Embodiments provide methods for etching and depositing silicon materials on a substrate. In one example, the method includes heating a substrate containing a silicon-containing material to a temperature of about 800° C. or less and removing a portion of the silicon-containing material and a contamin...
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Main Author | |
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Format | Patent |
Language | English |
Published |
22.03.2012
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Subjects | |
Online Access | Get full text |
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Summary: | Embodiments provide methods for etching and depositing silicon materials on a substrate. In one example, the method includes heating a substrate containing a silicon-containing material to a temperature of about 800° C. or less and removing a portion of the silicon-containing material and a contaminant to reveal an exposed surface of the silicon-containing material during an etching process and depositing a silicon-containing layer on the exposed surface of the silicon-containing material during a deposition process. The method further provides conducting the etching and deposition processes in the same chamber and utilizing chlorine gas and a silicon source gas during the etching and deposition processes. In some examples, the silicon-containing material is removed at a rate within a range from about 2 per minute to about 20 per minute during the etching process. |
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Bibliography: | Application Number: US201113305235 |