METAL PATTERN FORMATION SYSTEM

The invention discloses a metal pattern formation system produced in the following steps: an organic liquid is first printed on a substrate to form a base pattern. A metal is then evaporated to generate several metal particles for covering the printed substrate. At last, the substrate is heated to v...

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Bibliographic Details
Main Authors YEH SHANG-WANQ, SHY HSIOU-JENG, CHEN LI-JIUAN, HUANG CHIEN-HO, TSO CHING-YU
Format Patent
LanguageEnglish
Published 15.03.2012
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Summary:The invention discloses a metal pattern formation system produced in the following steps: an organic liquid is first printed on a substrate to form a base pattern. A metal is then evaporated to generate several metal particles for covering the printed substrate. At last, the substrate is heated to vaporize the base pattern, and the metal particles adhered to the substrate forms a metal pattern complementary to the base pattern.
Bibliography:Application Number: US201113241263