POLYAMIC ACID AND POLYIMIDE, PROCESSES FOR THE PRODUCTION OF SAME, COMPOSITONS CONTAINING SAME, AND USES THEREOF

The purpose of the present invention is to provide a polyimide resin which exhibits higher heat resistance than that of a conventional polyimide resin by controlling the geometric configuration of the constituent units. Provided is a polyamic acid which comprises repeating units represented by gener...

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Bibliographic Details
Main Authors YAMASHITA WATARU, SAKATA YOSHIHIRO, FUKUKAWA KENICHI, OKAZAKI MASAKI, FUJIO ICHIRO
Format Patent
LanguageEnglish
Published 29.12.2011
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Summary:The purpose of the present invention is to provide a polyimide resin which exhibits higher heat resistance than that of a conventional polyimide resin by controlling the geometric configuration of the constituent units. Provided is a polyamic acid which comprises repeating units represented by general formula (1), wherein the 1,4-bismethylenecyclohexane skeleton units consist of both trans- and cis-form units, and the contents of the trans- and cis-form units are 60 to 100% and 0 to 40% respectively (with the sum total of the trans- and cis-form units being 100%).
Bibliography:Application Number: US201013203343