COOLING ARRANGEMENT FOR A RACK MOUNTED PROCESSING DEVICE

To increase air flow, an air intake/outtake (i.e., intake, outtake, or both) is positioned on a front surface of a housing, such as a rack-mounted computer network switch housing. The front surface includes jacks, controls, plugs, receptacles or other input/output for connection with the processor i...

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Bibliographic Details
Main Authors NGUYEN TOAN, HUYNH HONG TRAN, NARASIMHAN SUSHEELA NANJUNDA RAO, TING PHILLIP S, LU DUONG CU
Format Patent
LanguageEnglish
Published 01.12.2011
Subjects
BLASTING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
HEATING
LIGHTING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MECHANICAL ENGINEERING
PRINTED CIRCUITS
WEAPONS
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Summary:To increase air flow, an air intake/outtake (i.e., intake, outtake, or both) is positioned on a front surface of a housing, such as a rack-mounted computer network switch housing. The front surface includes jacks, controls, plugs, receptacles or other input/output for connection with the processor in the housing. The air intake/outtake is one or more openings on the front surface with the input/output components. In one embodiment, to avoid interference with the input/output components and increasing the height of the housing, the air intake/outtake is a slot extending most of or all of the distance between the sides of the housing and being above or below the input/output. An intermediate plate may be used to form and support the air intake/outtake.
Bibliography:Application Number: US20100787171