Silicon Chip Having Penetrative Connection Holes

Two circuit layout areas on two surfaces of a chip are connected. Holes in the chip are coordinated with a conductive paste to connect the two surfaces. Thus, fabrication is made easy and cost is reduced.

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Bibliographic Details
Main Authors LAI TUNG-SHENG, CHU TSE MIN
Format Patent
LanguageEnglish
Published 01.12.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Two circuit layout areas on two surfaces of a chip are connected. Holes in the chip are coordinated with a conductive paste to connect the two surfaces. Thus, fabrication is made easy and cost is reduced.
Bibliography:Application Number: US201113041669