SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

The degree of freedom of the chip layout in a semiconductor device is improved, and improvement in packaging density is aimed at. Since it becomes possible to form the wire of two directions on the pad of a memory chip by performing the over-bonding of reverse bonding by ball bonding, an effect equi...

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Bibliographic Details
Main Authors KAWANABE NAOKI, WADA TAMAKI, ONO HIROSHI, MUTO NOBUYASU
Format Patent
LanguageEnglish
Published 03.11.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The degree of freedom of the chip layout in a semiconductor device is improved, and improvement in packaging density is aimed at. Since it becomes possible to form the wire of two directions on the pad of a memory chip by performing the over-bonding of reverse bonding by ball bonding, an effect equivalent to continuation stitch bonding of wedge bonding can be produced by ball bonding. Hereby, the degree of freedom of a chip layout and the degree of freedom of the lead layout of substrate 3 can be improved, and the packaging density on a substrate in a chip lamination type semiconductor device (memory card) can be improved.
Bibliography:Application Number: US201113179468