Ovenable cook-in film with reduced protein adhesion
The presently disclosed subject matter relates generally to packaging films that exhibit favorable sealing characteristics and reduced adhesion to meat at high temperatures. The presently disclosed subject matter also relates to packages constructed from such films and methods of using the films in...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English |
Published |
29.09.2011
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The presently disclosed subject matter relates generally to packaging films that exhibit favorable sealing characteristics and reduced adhesion to meat at high temperatures. The presently disclosed subject matter also relates to packages constructed from such films and methods of using the films in high temperature applications. |
---|---|
Bibliography: | Application Number: US20100661805 |