Ovenable cook-in film with reduced protein adhesion

The presently disclosed subject matter relates generally to packaging films that exhibit favorable sealing characteristics and reduced adhesion to meat at high temperatures. The presently disclosed subject matter also relates to packages constructed from such films and methods of using the films in...

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Bibliographic Details
Main Authors HOFMEISTER FRANK M, HUNTER AMY, BREBION HERVE M, OWENSBY JOSEPH E
Format Patent
LanguageEnglish
Published 29.09.2011
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Summary:The presently disclosed subject matter relates generally to packaging films that exhibit favorable sealing characteristics and reduced adhesion to meat at high temperatures. The presently disclosed subject matter also relates to packages constructed from such films and methods of using the films in high temperature applications.
Bibliography:Application Number: US20100661805