METHOD FOR DETACHING WAFERS FROM A WAFER CARRIER AND DEVICE FOR THIS PURPOSE
In a method for detaching wafers from a carrier unit, the wafers being formed by sawing a wafer block fastened to the carrier unit by gluing, and the wafers themselves still being glued on one side, the carrier unit with the wafers is introduced into an ungluing unit along a uniform movement plane....
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
01.09.2011
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Subjects | |
Online Access | Get full text |
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